• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to the use as a thin-film sensitive material for the bolometric detection of at least one material based on an alloy comprising at least one chalcogenide, characterized in that said material additionally contains an effective amount of carbon and / or boron and in that it has a value of relative coefficient of variation of the resistivity with the temperature, at 300 ° C, at least equal to 40% of the native value of the relative coefficient of variation of the resistivity with the temperature of said material at room temperature. The invention also relates to a bolometric device and its method of preparation.
    公开号:FR3016211A1
    申请号:FR1450120
    申请日:2014-01-08
    公开日:2015-07-10
    发明作者:Denis Pelenc；Marie-Francoise Armand；Berangere Hyot；Pierre Imperinetti；Claire Vialle
    申请人:Commissariat a lEnergie Atomique CEA；Commissariat a lEnergie Atomique et aux Energies Alternatives CEA；
    IPC主号:
    专利说明:

    [0001] The present invention relates to sensitive materials useful for the bolometric detection of infrared radiation by microsensor matrices. Infrared radiation detectors can be classified into two categories according to the physical principle that they implement. Quantum detectors and thermal detectors. The invention more particularly relates to the field of thermal detectors. These detectors operate advantageously at room temperature. They are able to absorb incident infrared radiation and convert it into heat. To this end, they generally comprise a sensitive element based on a material whose electrical resistance varies with temperature. The variation of temperature of the sensitive element causes a variation of the electrical resistivity of said sensitive element. These devices therefore make it possible, by means of an appropriate electrical circuit, to convert a modification of the temperature into an electrical signal.
    [0002] Depending on the property used, the detectors may be of the thermoelectric (thermopiles), pyroelectric (pyrometers) or bolometric type, the latter corresponding to the field of the invention. As indicated above, the bolometric detectors use as a sensitive element a material whose electrical resistivity varies with temperature. This resistivity is characterized by the relative coefficient of variation of the resistivity with the temperature (TCR) of the material, defined by the formula: TCR = 1 / p. dp / dT where p is the resistivity of the material. An appropriate electrical circuit is used to convert the temperature change into an electrical signal. Thus, to make an image in the infrared range, the sensitive element placed in the focal plane of the camera is a matrix consisting of bolometric pixels, each of them being formed of a suspended membrane, thermally insulated from its support to optimize the temperature increase due to absorption. This membrane generally comprises an infrared radiation absorbing material and the sensitive material.
    [0003] The production of these pixel matrices uses thin film deposition, photolithography and etching techniques implemented in the field of Electro-Mechanical Micro Systems (MEMS). The sensitive materials used for producing the bolometric pixel arrays must therefore be compatible with the constraints imposed by the integration steps. Chalcogenides, materials based on sulfur, selenium or tellurium, are in particular proposed to constitute this sensitive material. Thus, US 3,781,748 describes, as a sensitive element, a T12SeAs2Te3 chalcogenide glass of about thirty microns in thickness, which takes advantage of the sensitivity of the resistivity of this material with temperature. However, this material is implemented by a hot pressing technique at a temperature close to the glass transition temperature of this material (at around 100 ° C.) which is incompatible with the techniques for integrating microbolometer matrices which expose the material to high temperatures. In addition, such a technique is also incompatible with the requirements for controlling the thickness of layers that must be of the order of a few tens of nanometers thick. US Pat. No. 3,767,928 also describes the production of a matrix of detectors whose sensitive elements are chalcogenides. However, the embodiment of this matrix of detectors is not compatible with that implemented in the Micro Electro-Mechanical Systems. In particular, the sensitive element is not thermally insulated from the substrate as it is with a suspended membrane, which causes the detector described in this document to have a low sensitivity, which is incompatible with the performance of the bolometric detector matrices at present. marketed.
    [0004] More recently, document US 2012/0132804 has described for its part the production of a matrix of microbolometers based on chalcogenides that uses the technologies of Micro Electro-Mechanical Systems. The materials described therein have a TCR coefficient located in a very high range of values, of the order of 4% / K, much higher than that of conventionally used materials such as Vox (vanadium oxide mixtures) and amorphous silicon, whose TCRs are of the order of 1.5 to 2% / K. This high TCR value of chalcogenide materials actually makes them attractive for application in bolometry. However, these materials are sensitive to exposure to oxidizing atmospheres. Thus, during the integration of the bolometric pixel arrays, and in particular during the step of releasing the bolometric plate by calcination of the sacrificial layer, these materials oxidize and then become unusable for a bolometric application. The solution adopted to prevent this oxidation generally consists in isolating these materials from the external atmospheres by covering them with an encapsulation layer. However, the implementation of such a layer requires exposing the material to high temperatures, of the order of 300 ° C. However, as illustrated in Example 1, the exposure of these materials to such temperatures significantly degrades their TCR coefficient making them unsuitable for application in bolometry. This same problem is encountered during the vacuum packaging of microbolometers in hermetic boxes, necessary for their operation, which requires the oven and the microbolometer to be steamed, including the sensitive material, at higher temperatures, typically higher at 250 ° C. There remains therefore a need for a sensitive material that at least partially compensates for the deficiencies discussed above. The present invention aims precisely to meet this need. Thus, according to one of its aspects, the invention relates to the use as a thin-film sensitive material for the bolometric detection of at least one material based on an alloy comprising at least one chalcogenide, characterized in that said material further contains an effective amount of carbon and / or boron and has a relative coefficient of variation of temperature resistivity (TCR) at 300 ° C of at least 40% the native value of the relative coefficient of variation of the resistivity with the temperature of said material at room temperature. For the purposes of the present invention, the term "effective amount" means the amount of carbon and / or boron advantageously necessary to confer on said material a TCR value, at 300 ° C., of at least 40% of the native value. TCR of said material at room temperature. This amount of carbon and / or boron is to be considered with respect to the alloy and can therefore vary from one alloy to another. From his general knowledge, the skilled person is able to adjust the amount of carbon and / or boron needed to give said material the desired TCR value.
    [0005] Unexpectedly, the inventors have discovered that the combination, in the form of thin layers, of an alloy comprising at least one chalcogenide with an effective amount of carbon and / or boron, proves particularly effective as sensitive materials. for bolometric devices for infrared detection. These materials also have no problem of integration into a bolometric system. The inventors have in fact surprisingly found that the TCR coefficient of the materials as defined above does not significantly decrease when exposed to high temperature. They can thus be exposed, if necessary, to the temperature required to perform an encapsulation deposit, essential to protect them from the oxidizing conditions of release of the bolometric plate, while maintaining a high TCR coefficient. The present invention furthermore relates, in another of its aspects, to a bolometric device for the detection of infrared radiation or for infrared imaging, comprising at least one sensor provided with a sensitive element based on a material such as as defined above. Advantageously, the sensor is inserted into a housing comprising an infrared-transparent entrance window, and furthermore comprises a membrane capable of absorbing infrared radiation and of converting it into heat, said membrane being arranged so as to be able to be exposed to incident infrared radiation having passed through the inlet window, and transmitting a portion of the heat thus produced to said sensing element. According to yet another of its aspects, the present invention relates to a method of manufacturing a bolometric device comprising at least the following steps: i) having a sensor provided with a membrane capable of absorbing infrared radiation, deposited on a support consisting of a sacrificial layer; and ii) forming in contact with said membrane a thin layer of a sensitive element from a material as defined above.
    [0006] According to a preferred variant, step ii) is followed by a step iii) in which said thin layer is encapsulated by a so-called encapsulation layer, in particular based on SiN.
    [0007] In particular, step iii) is followed by a step iv) in which the sacrificial layer is calcined under oxidizing conditions, preferably under ozone plasma. According to another preferred variant, the bolometric device is subjected, after step iv), to at least one annealing step at a temperature of between 300 ° C. and 400 ° C., preferably between 320 ° C. and 400 ° C. . Such an additional annealing step advantageously allows the material to optimize its resistivity for an application in bolometry while maintaining a high TCR coefficient.
    [0008] Sensitive material Unexpectedly, the inventors have thus found that the combination of an alloy-based material comprising at least one chalcogenide and an effective amount of carbon and / or boron makes it possible to access a material sensitive for bolometric devices for detecting the infrared advantageously provided with a moderate electrical resistivity, a low low sequence noise and a high sensitivity to temperature. The sensitivity of a bolometric detector material is expressed using the temperature coefficient a which represents the derivative of the resistance with respect to the temperature, divided by the resistance: 1 a = -Xx 1 - dr R The coefficient a is expressed in% .Kelvin-1 (% .K-1). As stated above, the TCR coefficient of the materials according to the invention does not significantly decrease when exposed to high temperature. They can thus be exposed to the temperatures required for the development of the bolometric system. Thus, according to the invention, the sensitive material used in a bolometric device has a value of relative coefficient of variation of the resistivity with the temperature, at 300 ° C, at least equal to 40% of the native value of the coefficient of relative variation resistivity with the temperature of said material at room temperature.
    [0009] According to a preferred embodiment, the value of the relative coefficient of variation of the resistivity with the temperature, at 300 ° C., of the sensitive material used according to the present invention is at least 60%, preferably at least 75%. %, in particular at least 90%, of the native value of the relative coefficient of variation of the resistivity with the temperature of said material at room temperature. Preferably, the chalcogenide present in the alloy is selected from sulfur, selenium, tellurium and mixtures thereof. In particular, it is tellurium. According to a particular embodiment, the alloy further comprises at least one element selected from antimony, germanium, tin, bismuth and mixtures thereof.
    [0010] Preferably, the alloy comprises at least germanium. More preferably, the alloy comprises from 40% to 70% by weight of tellurium, from 5% to 60% by weight of germanium, from 0% to 50% by weight of an element X selected from antimony, tin or bismuth and 0% to 50 atomic% of an element Y, different from the element X, selected from antimony, tin or bismuth.
    [0011] According to a first preferred variant, the alloy comprises from 40% to 60% by weight of tellurium and from 40% to 60% by germanium. According to a second preferred variant, the alloy comprises from 48% to 64% by weight of tellurium, from 18% to 26% by weight of germanium and from 18% to 26% by weight of antimony.
    [0012] According to another preferred embodiment, the alloy comprising at least one chalcogenide corresponds to the formula: TewGe (i) X (pY (1) in which X and Y represent, independently of one another, selected from antimony, tin or bismuth - (i) varies from 0.4 to 0.7, - (j) ranges from 0.05 to 0.6, - (k) ranges from 0 to 0.5 - (1) varies from 0 to 0.5, with the sum of (i) + (j) + (k) + (1) being equal to 1. Preferably, the value of (i) is greater than the value of (j), preferably the value of k is different from 0.
    [0013] According to a preferred embodiment, the sensitive material contains at least an effective amount of carbon. Those skilled in the art are able to determine the quantity necessary to confer on said material the desired TCR value. In particular, the material contains between 5% and 60% by weight, preferably between 15% and 45% by weight, and better still between 17% and 30% by weight, of carbon relative to the atomic composition of said material. Thus, according to a preferred embodiment, the sensitive material according to the invention used in a bolometric device corresponds to the formula: Te (i) GewX (k) Y (1) C (m) in which, - X and Y represent independently of one another, an element selected from antimony, tin or bismuth; - (i) varies from 0.3 to 0.7; - (j) varies from 0.03 to 0.6; - (k) varies from 0 to 0.5; - (1) varies from 0 to 0.5; - (m) varies from 0.05 to 0.6; with the sum of (i) + (j) + (k) + (1) + (m) being equal to 1. The atomic composition of the sensitive material can be characterized by RBS (Rutherford Backscattering Spectrometry) and PIXE (Particle Induced) X-Ray Emission) for heavy elements (Te, Ge, Sb, Bi, Sn) and NRA (Nuclear Reaction Analysis) for light elements (C and B). Bolometric device As previously mentioned, another aspect of the invention relates to a bolometric device for detecting infrared radiation or for infrared imaging, comprising at least one sensor provided with a sensitive element based on a material as defined above. Advantageously, the sensitive element is implemented in the form of a thin layer. Preferably, such a thin layer has a thickness ranging from 10 to 500 nm.
    [0014] According to a particular embodiment of the bolometric device of the invention, the sensor, which is inserted into a housing comprising an infrared-transparent input window, furthermore comprises a membrane capable of absorbing infrared radiation and of converting it into heat, said membrane being arranged to be exposed to incident infrared radiation having passed through the entrance window, and to transmit a portion of the heat thus produced to said sensing element. The invention also relates to the method of manufacturing such a bolometric device comprising at least the following steps: i) having a sensor provided with a membrane capable of absorbing infrared radiation, deposited on a support consisting of a sacrificial layer; and ii) forming in contact with said membrane a thin layer of a sensitive element from a material as defined above. In order to form the thin layer of the sensitive element, the material according to the invention can for example be deposited on the membrane according to a co-spray technique. Thus, according to a particular embodiment, the chalcogenide-based alloy and the carbon or boron are deposited by a co-spray technique from two targets, one consisting of carbon or pure boron and the other of the chalcogenide alloy. Specifically, the spray equipment consists of three targets 76 mm in diameter arranged in a "bouquet", allowing co-spraying. The inclination of the targets is 60 ° to the horizontal and the target-substrate distance is 37 mm. The residual pressure of the chamber is 2.10-7 mbar and the working pressure (during co-spraying) is 4.101 mbar. Argon is used as a carrier gas. The carbon or boron composition of the alloy is obtained by applying adequate current values to each of the two targets. For example, the composition Ge19-FiSbi9-FiTe4o + 2.5C22 + tat% is obtained by applying a current of 200 mA and 80 mA on the targets of C and Ge2Sb2Te5 respectively. The deposition rate of this alloy is 2.1 Å / s.
    [0015] According to other embodiments, the deposition of the sensitive material, dedicated to form the thin layer, can also be carried out by sputtering techniques IBS (Ion Beam Sputtering) or by techniques of ALD (Atomic Layer Deposition).
    [0016] With regard to the membrane on which is formed the thin layer based on the material according to the invention, it may consist for example of one or more dielectric layer (s) including SiO and / or SiN. In the case of a single layer, it may be partially covered by electrodes including TiN having a high absorption of infrared radiation. In the case of two layers, the electrodes may be either affixed to the surface of the outer layer or enclosed between the two layers. According to a particularly advantageous embodiment, step ii) of the manufacturing process is followed by a step iii) in which said thin layer is encapsulated by a so-called encapsulation layer, in particular based on SiN. Preferably, this step iii) is followed by a step iv) in which the sacrificial layer is calcined under oxidizing conditions, preferably under ozone plasma. As indicated above, the bolometric device is advantageously subjected, after step iv), to at least one annealing step at a temperature of between 300 ° C. and 400 ° C., preferably between 320 ° C. and 400 ° C. In particular, the annealing step can be carried out under vacuum or under an inert atmosphere. The temperature of the annealing step can be reached by temperature reduction, in particular by ramp of 10 ° C./min, and optionally include isothermal annealing. FIG. 1 shows a simplified view of a bolometric device according to the invention. The bolometric device shown therein comprises a thin membrane 10 capable of absorbing infrared radiation, and suspended above a support 13 via anchor points 11. A sensitive layer 14 is deposited on the membrane 10. This layer 14 is encapsulated by an encapsulation layer, not shown in Figure 1, which protects it during technological operations subsequent to the deposition of the layer 14. Under the effect of infrared radiation, the membrane 10 30 is heated up and transmits its temperature to the layer 14. The electrical interconnection between the sensitive layer 14 and the reading elements (not shown) disposed on the substrate is provided by a layer, generally metallic, not shown, passing through the anchoring points 11. The sensitivity of the thermal detection is notably improved by introducing isolation arms 12 between the support substrate and the membrane in order to limit the thermals of this last. The resistivity variations of the sensitive layer are recorded using an appropriate reading circuit.
    [0017] In the bolometric devices according to the invention, the support substrate may consist of an integrated electronic circuit on a silicon wafer comprising, on the one hand, devices for stimulating and reading temperature variations and, on the other hand, the components of multiplexing that can serialize the signals from different thermometers and transmit them to a small number of outputs to be operated by a common imaging system. FIG. 2 represents a section of FIG. 1 along AA 'and illustrates two variants of integration of a thin layer of material according to the invention in a coplanar electrode detector. In FIG. 2A, the structure supporting a thin layer 20 of material according to the invention consists of two insulating layers 21 and 22 enclosing the metal electrodes 23. The insulating layer 22 deposited on the metal layer has contact openings so as to connect the sensitive element. The layer 25 is the encapsulation layer, for example of SiN, which may be necessary for the protection of the material during the technological step of releasing the sacrificial layer, in particular polyimide, made in an ozone plasma. In FIG. 2B, the structure supporting a thin layer 26 of material according to the invention consists of a single insulating layer 27 on which the metal electrodes 28 rest directly in contact with the sensitive element 26. In this configuration, it can be interesting to deposit an infrared absorbing layer on one of the faces of the structure. As in FIG. 2A, the material according to the invention 26 is covered by an encapsulation layer 29, for example made of SiN. In these two embodiments, the etching of a thin layer of material according to the invention makes it possible to remove the material in the region of the isolation arms and in the regions separating the detectors from each other. These two embodiments advantageously lead to an optimized component in terms of signal-to-noise ratio.
    [0018] It is understood that the bolometric devices according to the invention may comprise a plurality of sensors in the form of a matrix array of pixels. Such a sensor array can be connected for example to a CCD or CMOS matrix. With an appropriate imaging system, the device of the invention then constitutes an infrared camera. The bolometric devices of the invention can also be integrated in so-called monolithic structures, collectively manufactured by the microelectronics processes that have been developed for silicon. Thus, monolithic infrared imagers operating at ambient temperature can be manufactured by directly connecting a matrix of sensitive elements to a CMOS or CCD type of multiplexing circuit. The support substrate may consist of an integrated electronic circuit comprising, on the one hand, stimulus and reading devices and, on the other hand, the multiplexing components which make it possible to serialize the signals coming from the different detectors and to transmit them to a number reduced outputs to be exploited by a conventional imaging system. In such devices, the insulating supports are made in the form of thin layers having for example a thickness of 5 to 100 nm. These insulating elements (for example SiN, SiO, ZnS, etc.) are obtained using the low-temperature deposition techniques normally used for these materials, such as cathodic sputtering or plasma-assisted chemical vapor deposition (PECVD). ). The etching of these materials is generally performed by plasma etching methods. The metallic materials constituting the electrodes (for example Ti, TiN, Pt, etc.) are preferably deposited by sputtering. The shape of the electrodes is defined by chemical etching or plasma methods. The thickness of the electrodes is for example between 5 nm and 100 nm. The electrodes which extend in the isolation arms are connected to the input stage of the read circuit by conventional methods of contact recovery, and are adapted to the structure of the micro-bridge (similar to the anchor points). 11 of Figure 1).
    [0019] The material is deposited in the form of a thin layer according to the invention, using the copulverisation technique or by IBS sputtering techniques or by ALD techniques mentioned above. Its etching can be carried out chemically (HC1, H3PO4) or by specific plasma etching processes, or by ion milling. The invention also relates to a method for detecting infrared radiation or infrared imaging production, using a bolometric device capable of absorbing incident radiation, converting it to heat, and communicating a part heat generated at a sensitive element whose resistivity varies with temperature, wherein said device is as defined above. The device of the invention is usable in many fields of application, for example in the military field (devices for sighting and night exploration), in the industrial field (parts control), in the field of safety ( detection of fires, identification of victims in smoke-filled rooms, night surveillance of sites, assistance with night driving of vehicles), or in the medical field (blood circulation mapping, mammography, etc.).
    [0020] The examples and figures which follow are presented as an illustration and not a limitation of the field of the invention. FIG. 1 schematically represents a simplified perspective view of an embodiment of a bolometric device according to the invention.
    [0021] FIG. 2 represents a section of FIG. 1 according to AA 'and accounts for two integration variants of a thin layer of material according to the invention in a coplanar electrode detector. EXAMPLE Synthesis of materials according to the invention and characterization of their value of the coefficient of variation of the resistivity with temperature (TCR) and of their annealing temperature of the resistivity adjustment a) Synthesis of the materials Thermometers materials based on a GeTe or Ge2Sb2Te5 alloy, or a GeSbTe alloy with different percentages of carbon are produced.
    [0022] The alloy is deposited by a co-spray technique from two targets, one with pure carbon and the other with chalcogenide alloy. The spray equipment has three targets arranged in a "bouquet", allowing co-spraying. The inclination of the targets is 60 ° C relative to the horizontal and the target-substrate distance is 37 mm. The residual pressure of the chamber is 2.10-7 mbar and the working pressure (during co-spraying) is 4.101 mbar. Argon is used as a carrier gas. The variation in the carbon composition of the alloy is obtained by modifying the value of the currents applied to each of the two targets. For example, the composition Ge19-FiSbi9-FiTe4o + 2.5C22 + iat% is obtained by applying a current of 200 mA and 80 mA on the targets of C and Ge2Sb2Te5 respectively. The deposition rate of this alloy is 2.1 A / s. The materials are deposited on a 750 nm SiO2 layer to form a 100 nm layer. b) Measurements of the coefficient TCR Measurements of the coefficient of variation of the resistivity with the temperature (TCR) are carried out on the different materials. In particular, the TCR of each material is measured by a conventional technique for measuring electrical resistivity of layers deposited on insulation ("4-point method"). The measuring device further comprises a heating plate for regulating the temperature of the layer to ± 0.1 ° C and measuring its resistivity p28 and p32 at 28 ° C (T28) and 32 ° C (T32) respectively. . The TCR of the material at room temperature is obtained via the relation: TCR = 1 / ((p32 ± P28) / 2) - ((P32-P28) / (T32-T28)) Its value after spray deposition (material such as as deposited) is compared to that measured when the temperature has fallen back to room temperature (30 ° C) on the same sample after it has been exposed to a temperature of 300 ° C for 5 seconds in an oven under an argon atmosphere or under vacuum. The results are shown in Table 1 below.
    [0023] Table 1 TCR Material Measured on TCR Material Measured on Material After Exposure Exposure at 300 ° C for 5 (% .e) (+/- 0.3% .1 <- ') seconds (% .e) (+/- 0.3% .1 <- ') GeTe (Comparative) -4.7 -0.2 Alloy GeTe + C: Ge48 + 3Te42 + 3C10 + 1.5at% -5.1 -4.9 Ge2Sb2Te5 (Comparative) -4 , 7 -0.6 Alloy Ge2Sb2Te5 + C: Ge19 + ISb19 + ITe40 + 2.5C17-Flat% -4.6 -0.34 (Comparative) Alloy Ge2Sb2Te5 + C: Ge19 + ISb19 + ITe40 + 2.5C22-Flat% - 5.6 -5.4 Alloy Ge2Sb2Te5 + C: Ge15 + 1Sb15 + ITe30 + 2.5C40-Flat% -5.3 -4.2 When the chalcogenide alloy is associated with sufficient carbon (as per example of the order of 22% for the chalcogenide Ge2Sb2Te5), the material retains a high TCR value after exposure to a temperature of 300 ° C. Therefore, it is appropriate for a bolometric application. In contrast, exposure of chalcogenide-based alloys alone at 300 ° C or with a non-efficient amount of carbon results in a significant decrease in the TCR value. Such a decrease in the TCR value renders the material unusable for bolometric application. c) Determination of the Resistivity Adjustment Annealing Temperature Resistance and TCR measurements of the thermometer materials are made at a temperature of 30 ° C. after annealing at different temperatures for 5 seconds in a neutral atmosphere furnace. argon or vacuum.
    [0024] The TCR of each material is measured as indicated in b) above. The resistivity at room temperature is: = (P32 + p28) / 2 The overall results are detailed in Table 2.
    [0025] Table 2 Material Alloy 1 Alloy 2 GeSbTe + 22% C: GeSbTe + 40% C: Ge19-F1Sb19 + 1Te4o + 2.5C22 + Iat% Gels-FISb15 ± 1Te3o ± 2.5C40 ± lat% Material before TCR (% .K1) - 5.6 -5.3 exposure (+/- 0.3% .K1) p (ohm.cm) F 1.9 4 I.8 F4 Material after TCR (% .K- ') -5.4 -4.2 exposure at 300 ° C (+/- 0.3% .K1) for 5 seconds p (ohm.cm) 1.6'14 I.e4 Material in the TCR (% .K1) -3.35 -2.7 device ( +/- 0.3% .1 (1) bolometric after exposure to 325 ° C for 5 seconds p (ohm.cm) 194 -, Material in the TCR (% .K1) -3.0 -2.5 device ( +/- 0.3% .1 (1) bolometric after exposure to 330 ° C for 5 seconds p (ohm.cm) 5 133 Material in the TCR (% .K1) -2.4 -2.28 device (+ / - 0.3% .1 (1) bolometric after exposure to 340 ° C for 5 seconds p (ohm.cm) 3 I - The application of an annealing step to the bolometric device comprising a thermometer material based on a carbon-associated GeSbTe alloy allows both to maintain a high TCR value and a resistivity for optimal operation of the reading system. In the case of Ge19-uSb19,1Te40 + 2.5C22 ± lat%, an annealing at 330 ° C makes it possible to obtain a resistivity of less than 100 Ohm.cm. In the case of Ge15.1Sb15.1Te30 + 2.5C40 ± lat%, an annealing at 340 ° C makes it possible to obtain a resistivity of less than 100 Ohm.cm. d) Preparation of microbolometers The annealing temperature of the resistivity adjustment being determined in c), this annealing is carried out before the boxing of the microbolometer, after step iv) of calcination of the sacrificial layer described above.
    权利要求:
    Claims (25)
    [0001]
    REVENDICATIONS1. Use as a thin-film sensitive material for bolometric detection of at least one alloy-based material comprising at least one chalcogenide, characterized in that said material further contains an effective amount of carbon and / or boron and in that it has a value of relative coefficient of variation of the resistivity with the temperature, at 300 ° C, at least equal to 40% of the native value of the relative coefficient of variation of the resistivity with the temperature of said temperature material room.
    [0002]
    2. Use according to claim 1, characterized in that the value of the relative coefficient of variation of the resistivity with the temperature at 300 ° C is at least 60%, preferably at least 75%, in particular at least 90%, of the native value of the relative coefficient of variation of the resistivity with the temperature of said material at room temperature.
    [0003]
    3. Use according to any one of claims 1 or 2, characterized in that the alloy comprises at least one chalcogenide selected from sulfur, selenium, tellurium and mixtures thereof.
    [0004]
    4. Use according to any one of the preceding claims, characterized in that the alloy comprises at least tellurium.
    [0005]
    5. Use according to any one of the preceding claims, characterized in that said material contains at least an effective amount of carbon.
    [0006]
    6. Use according to any one of the preceding claims, characterized in that said material contains between 5% and 60% by weight, preferably between 15% and 45% by weight, and better still between 17% and 30% by weight, of carbon by weight. Relative to the atomic composition of said material.
    [0007]
    7. Use according to any one of the preceding claims, characterized in that the alloy further comprises at least one element selected from antimony, germanium, tin, bismuth and mixtures thereof.
    [0008]
    8. Use according to any one of the preceding claims, characterized in that the alloy further comprises at least germanium.
    [0009]
    9. Use according to any one of the preceding claims, characterized in that the alloy comprises from 40% to 70% by weight of tellurium, from 5% to 60% by weight of germanium, from 0% to 50% by weight of an element. X selected from antimony, tin or bismuth and from 0% to 50 atomic% of an element Y, different from the element X, selected from antimony, tin or bismuth.
    [0010]
    10. Use according to any one of the preceding claims, characterized in that the alloy comprises from 40% to 60% by weight of tellurium and from 40% to 60% by germanium.
    [0011]
    11. Use according to any one of claims 1 to 9, characterized in that the alloy comprises from 48% to 64% by weight of tellurium, from 18% to 26% by weight of germanium and from 18% to 26% by weight. 'antimony.
    [0012]
    A bolometric device for the detection of infrared radiation or for infrared imaging, comprising at least one sensor provided with a sensitive element based on a material as defined in any one of claims 1 to 11.
    [0013]
    13. Bolometric device according to claim 12, characterized in that the sensitive element is implemented in the form of a thin layer.
    [0014]
    14. bolometer device according to claim 13, characterized in that the thin layer has a thickness ranging from 10 nm to 500 nm.
    [0015]
    Bolometer device according to one of Claims 12 to 14, characterized in that the sensor is inserted into a housing having an infrared-transparent entrance window, and further comprises a membrane capable of absorbing radiation. infrared and converting it to heat, said membrane being arranged to be able to be exposed to incident infrared radiation having passed through the input window, and to transmit a portion of the heat thus produced to said sensing element.
    [0016]
    Apparatus according to any one of claims 12 to 15, comprising a plurality of said sensors in the form of a matrix array of pixels.
    [0017]
    17. Device according to claim 16, characterized in that said network is connected to a CCD or CMOS matrix.
    [0018]
    18. A method of manufacturing a bolometric device comprising at least the following steps: i) having a sensor provided with a membrane capable of absorbing infrared radiation, deposited on a support consisting of a sacrificial layer; andii) forming in contact with said membrane a thin layer of a sensitive element from a material as defined in any one of claims 1 to 11.
    [0019]
    19. The method of claim 18, characterized in that said membrane consists of one or more layer (s) dielectric (s), including SiO and / or SiN.
    [0020]
    20. Method according to any one of claims 18 or 19, characterized in that step ii) is followed by a step iii) wherein said thin layer is encapsulated by a so-called encapsulation layer, in particular based on SiN.
    [0021]
    21. The method of claim 20, characterized in that step iii) is followed by a step iv) in which the sacrificial layer is calcined under oxidizing conditions, preferably under ozone plasma.
    [0022]
    22. Method according to any one of claims 18 to 21, characterized in that the bolometric device is subjected, after step iv), to at least one annealing step at a temperature between 300 ° C and 400 ° C preferably between 320 ° C and 400 ° C.
    [0023]
    23. The method of claim 22, characterized in that the temperature of the annealing step is reached by temperature, particularly by ramp of 10 ° C / min.
    [0024]
    24. The method of claim 22 or 23, characterized in that the annealing step comprises isothermal annealing.
    [0025]
    25. Process according to any one of claims 22 to 24, characterized in that the annealing step is carried out under vacuum or under an inert atmosphere.
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    优先权:
    申请号 | 申请日 | 专利标题
    FR1450120|2014-01-08|
    FR1450120A|FR3016211B1|2014-01-08|2014-01-08|SENSITIVE MATERIAL FOR BOLOMETRIC DETECTION|FR1450120A| FR3016211B1|2014-01-08|2014-01-08|SENSITIVE MATERIAL FOR BOLOMETRIC DETECTION|
    JP2015000972A| JP2015143684A|2014-01-08|2015-01-06|Sensitive material for bolometric detection|
    EP15150357.0A| EP2894444A1|2014-01-08|2015-01-07|Sensitive material for bolometric detection|
    CA2877258A| CA2877258A1|2014-01-08|2015-01-07|Sensitive material for bolometric detection|
    US14/592,659| US9377364B2|2014-01-08|2015-01-08|Sensitive material for bolometric detection|
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